Simulation of thermal conditions of a radio-electronic block of a cassette design

  • Kamil Z. Khairnasov Department of Instrument Engineering Technology, Moscow Aviation Institute (National Research University), Moscow, Russia
Keywords: Conduction, electronic devices, finite element method, mathematical modeling, thermal regime.

Abstract

The modelling and study of the thermal conditions of the electronic unit of the cassette design installed in the open compartment of the spacecraft on a thermal stabilization platform operated in a vacuum is considered. One of the main issues of heat removal from electronic components is the effect of the characteristics of the intermediate layers of a multilayer printed circuit board on effective heat dissipation. Effective heat removal means determining the thickness of the intermediate copper layer, which significantly affects the heat removal and determination of the thickness of which does not lead to heat removal, but only increases the mass characteristics of the electronic device, which is one of the main parameters in aerospace engineering. The problem is solved by the finite element method. The convergence of the results was checked by thickening the grid of finite elements. If the results of the previous and subsequent, partitions differ by no more than 2-3%, then it is considered that the results of the calculations are valid. Thermal calculation of the cassette, performed by the finite element method, and analysis of the results showed that the thickness of the intermediate copper layers nonlinearly affects the temperature distribution in electronic components, with the greatest effect being observed when the thickness of the intermediate copper layer less than 175 microns. When the thickness of the intermediate copper layer is more than 175 μm, heat removal is ineffective in terms of weight characteristics. The calculation results illustrated by the figures of the distribution of the temperature field during module operation are presented.

Downloads

Download data is not yet available.

Author Biography

Kamil Z. Khairnasov, Department of Instrument Engineering Technology, Moscow Aviation Institute (National Research University), Moscow, Russia

PhD of Technical sciences, Associate Professor, Department of Instrument Engineering Technology, Moscow Aviation Institute (National Research University), Moscow, Russia

References

Costa R.L., Vlassov V., (2013). Evaluation of Inherent Uncertainties of the homogeneous Effective thermal Conductivity Approach in Modeling of Printed Circuit boards for Space Applications. Journal of Electronics Cooling and Thermal Control. 3, 35-41.

Dede E., Nomura T., Lee J. (2015). Design of anithotrupic thermal conductivity in multilayer printer circuit boards. IEEE Transactions on Components, Packaging, and Manufacturing Technology Institute of Electrical and Electronics Engineers. 5(12), 1763-1774.

Funk J.N., Mengüç M.P., Tagavi K., Cremers C.J., (1992). Semi-Analytical Method to Predict Printed Circuit Board Package Temperature. IEEE Transaction on components, hybrids and manufacturing technology. 15(5), 675-684.

Godin E.M., Khayrnasov K.Z., Sokolsky M.L. (2004). Computer-aided design and production management systems basics. Moscow: Publishing house of Moscow aviation institute.

Khairnasov K.Z. (2013). Modeling and thermal analysis of electronic devices of spacecraft. Bulletin of Moscow Aviation Institute. 3, 56-61.

Levashkin D., Ogin P., Vasilyev F.V. (2019). Efficiency of hybrid cyclic processing with the use of additive technologies on CNC machines for the manufacture of composite aviation parts due to the reduction of processing errors. International Russian Conference on Materials Science and Metallurgical Technology, Vladivostok, Russia. 946, 959-965.

Lucas J. (1994). Heat transfer and thermal regime of spacecraft. Moscow: Peace.

Medvedev A.M. (2005). Printed circuit boards. Constructions and materials. Moscow: Technosphere.

Monier-Vinard E., Laraqi N., Dia C.T., Nguyen M.N., Bissuel V. (2013). Analytical Thermal Modeling of Multi-Layered Active Embedded Chips into High Density Electronic Board. Thermal Science. 17(3), 695-706.

Muzychka Y.S., Bagnall K. R., Wang E. N. (2013). Thermal Spreading Resistance and Heat Source Temperature in Compound Orthotropic Systems With Interfacial Resistance. IEEE Transactions on Components, Packaging and Manufacturing Technology. 3(11), 1826-1841.

Muzychka Y.S., Yovanovich M.M., Culham J.R., (2006). Influence of Geometry and Edge Cooling on Thermal Spreading Resistance. Journal of Thermophysics and Heat Transfer, 20(2), 247-255.

Rinaldi N. (2006). Generalized Image Method with Application to the Thermal Modeling of Power Devices and Circuits, IEEE Transactions on Electron Devices, 49(4), 679-686.

Schacht R., Wunderle B., May D., Michel B., Reichl H. (2008). Modeling Guidelines and Non-Destructive Analysis for Thermal and Mechanical Behaviour of Via-Structures in Organic Boards. Thermal and Thermo-mechanical Phenomena in Electronic Systems Conference, 441-449.

Shabany Y. (2002). Component size and effective thermal conductivity of Printed Circuit Board. Inter Society Conference on Thermal Phenomena, 13.

Vantsov S., Vasilyev F., Medvedev A., Khomutskaya O. (2019). Epoxy-glass composite materials for substrate printed circuit boards gigabit electronics. Amazonia Investiga, 8(22), 434-442.

Vintrou S., Laraqi N., Baïri A., (2012). Calculation and analysis of thermal impedance of microelectronic structures from analytical models. Solid-State Electronics. 67, 45-52.
Published
2019-10-11
How to Cite
Khairnasov, K. (2019). Simulation of thermal conditions of a radio-electronic block of a cassette design. Amazonia Investiga, 8(23), 671-677. Retrieved from https://amazoniainvestiga.info/index.php/amazonia/article/view/918
Section
Articles