Simulation of thermal conditions of a radio-electronic block of a cassette design
The modelling and study of the thermal conditions of the electronic unit of the cassette design installed in the open compartment of the spacecraft on a thermal stabilization platform operated in a vacuum is considered. One of the main issues of heat removal from electronic components is the effect of the characteristics of the intermediate layers of a multilayer printed circuit board on effective heat dissipation. Effective heat removal means determining the thickness of the intermediate copper layer, which significantly affects the heat removal and determination of the thickness of which does not lead to heat removal, but only increases the mass characteristics of the electronic device, which is one of the main parameters in aerospace engineering. The problem is solved by the finite element method. The convergence of the results was checked by thickening the grid of finite elements. If the results of the previous and subsequent, partitions differ by no more than 2-3%, then it is considered that the results of the calculations are valid. Thermal calculation of the cassette, performed by the finite element method, and analysis of the results showed that the thickness of the intermediate copper layers nonlinearly affects the temperature distribution in electronic components, with the greatest effect being observed when the thickness of the intermediate copper layer less than 175 microns. When the thickness of the intermediate copper layer is more than 175 μm, heat removal is ineffective in terms of weight characteristics. The calculation results illustrated by the figures of the distribution of the temperature field during module operation are presented.
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