Testing of hidden defects in interconnections

Arkadiy M. Medvedev; Fedor V. Vasilyev; Mikhail L. Sokolsky

Arkadiy M. Medvedev Moscow Aviation Institute (National Research University), Moscow, Russia.
Fedor V. Vasilyev Moscow Aviation Institute (National Research University), Moscow, Russia.
Mikhail L. Sokolsky Moscow Aviation Institute (National Research University), Moscow, Russia.

Keywords: Current determination for testing, diagnostic non-destructive testing, electrical interconnects, electronic assembly, printed circuit boards.

Abstract

Electronic instrumentation has a constant growth density layout and functionality. This entails an increase in the density of interconnection elements by increasing their number and reducing the size of it. The growing cost of interconnection structures (printed circuit boards, printing and wired mounting) associated with their complexity and increase of their reliability requirements, result in the search of new and improved non-destructive diagnostic methods and means of control. However, the existing methods do not allow control interconnects with sufficient certainty to identify a significant number of hidden defects. This class of defects can be diagnosed by means of non-destructive testing of interconnections, based on the detection of controlled circuit reaction to a current. The paper describes the principles for calculating the current to exercise that control.

Downloads

Download data is not yet available.

Author Biographies

Fedor V. Vasilyev, Moscow Aviation Institute (National Research University), Moscow, Russia.

PhD, Associate Professor, Moscow Aviation Institute (National Research University), Moscow, Russia.

Mikhail L. Sokolsky, Moscow Aviation Institute (National Research University), Moscow, Russia.

Senior Lecturer, Electronics Manufacturing Department, Moscow Aviation Institute (National Research University), Moscow, Russia.

References

IEC 60194: (2006). Printed board design, manufacture and assembly. Terms and definitions. 120.
Armstrong K. (2001). Advanced printed circuit boards design and Layout for EMC. Part 6. Transmission Lines. 3rd. EMC & Compliance Journal, 1-30.

Chaudhary V., Dave I.R., Upla K.P. (2017). Automatic visual inspection of printed circuit board for defect detection and classification. 2017 International Conference on Wireless Communications, Signal Processing and Networking (WiSPNET), Chennai, 732-737.

Danilova E., Kochegarov I., Yurkov N., Miheev M., Kante N. (2018). Models of Printed Circuit Boards Conductive Pattern Defects. Applied Computer Systems. 2(23), 128-134.

Karpov S. (2010). Criteria in assessing the quality of manufacture of printed circuit boards. Technology in the electronics industry. 8.

Lulina V.I., Medvedev A.M., Mylov G.V., Semenov P., Serzhantov A. (2009). Production of flexible and flexible-rigid boards. Part 6. Special means of control and testing of printed circuit boards. Technology in the electronics industry. 1, 11-21.
.
Medvedev A.M. (1986). Reliability and quality control of printed circuit boards. Moscow: Radio and communication.

Medvedev A.M., Vasiliev F.V., Sokolsky M.L. (2013). Current source for the diagnostic control of electrical connections in avionics. Practical Power Electronics. 3(51), 54-56.

Medvedev A.M., Vasiliev F.V., Sokolsky M.L. (2013). Diagnostic control of electrical connections in avionics. Practical power electronics. 1(49), 42-44.
Webb S. (2006). Design Basics of High Speed PCBs. EDA Expert. 10(113), 81-83.

Medvedev A.M., Vasiliev F.V., Sokolsky M.L. (2013). Calculation of current load for diagnostic control of electrical connections in avionics. Practical Power Electronics. 2(50), 45-48.

Pfeil C., Holden H. (2007). HDI Layer Stackups for Large Dense PCBs. www.mentor.com/pcb. 11.

Rasika R., Gautami D., Swati A., Mayuri B., Archana S. (2016). Quality Control of printed circuit boards using Image Processing. International Journal of Computer Applications. 141(5), 28-32.

Remesh Kumar K. R., Shreekrishna Kumar K. (2019). Testing of Current Carrying Capacity of Conducting Tracks in High Power Flexible Printed Circuit Boards. Journal of Electronic Testing. 2 (35), 131-143.

Vorunichev D.S., Zasovin E.A. (2019). Metallographic Analysis during Multilayer Printed Circuit Board Production Quality Assurance with Interlayer Connections Composed of Radio-Electronic Systems. Journal of Communications Technology and Electronics. 2(64), 182-185