Epoxy-glass composite materials for substrate printed circuit boards gigabit electronics
Keywords:
Avionics, dielectric, epoxy-glass composite Materials, LTCC-ceramics, printed circuits boards, PTFE, scin-effect.
Abstract
The development of printed circuit board technology is a subject to the general trend of electronics development, an increase in functionality and performance. This requires printed circuit boards to increase the assembly density of electronic components and interconnections and reduction of constructive delays in transmission lines of information. Seemingly, this will require the use of high frequency materials such as polytetrafluorethylenes (PTPE) or radiofrequency ceramics. However, this would require a multi-billion dollar restructuring of the industry of printed circuit boards. The article shows that under certain conditions it is possible to do without the restructuring of the industry, remaining on traditional foil epoxy-glass composite dielectrics. But for this purpose, it is necessary to take into account their characteristics and properties of their components.
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Brook D. (2010). Skin Effect. UltraCAD Design, Inc. https://www.ultracad.com/articles/skin%20effect.pdf.
Coombs С.F. (2008). Handbook Printed Circuits. New-York: McGraw-Hill Companies.
Coonrod J, Horn III A.F. (2011). Understanding Dielectric Constant for Microwave PCB Materials. High Frequency Electronics, 10(7), 18-24.
Cuming Microwave Corporation (2016). Low Loss Dielectric Stock Materials, https://www.cumingmicrowave.com/products/low-loss-dielectric-stock-materials.html.
Horn III A.F., Reynolds J.W., LaFrance P.A., Rautio J.C. (2010). Effect of conductor profile on the insertion loss, propagation constant, and dispersion in thin high frequency transmission lines, DesignCon 2010, 1-22.
IPC (2018). Association Connecting Electronics Industries. IPC 4562. Metal Foil for Printed Wiring Applications. https://www.ipc.org/TOC/IPC-4562A.pdf.
IPC (2018). Association Connecting Electronics Industries. IPC-2141 Controlled Impedance Circuit Boards and High Speed Logic Design. www.ipc.org.
IPC (2018). Association Connecting Electronics Industries. IPC-PCB Technology Trend 2018. www.ipc.org.
IPC (2018). Association Connecting Electronics Industries. IPC-TM-650, Method 2.6.25A. https://www.ipc.org/test-methods.aspx.
Isola introduces ultra-low loss materials for 100 gigabit Ethernet applications. 2014. Microwave journal. https://www.microwavejournal.com/articles/22539.
Medvedev A. (2016). A metalized-hole PCB as a strain gauge. Instruments and Experimental Techniques, 59, 879-881.
Medvedev A. (2017). When it's not about the board. Recommendations for assembly and production technologists. Electronics – Science. Technology. Business, 10, 108-113.
Mittal A. (2018). How to Analyze a PCB Transmission Line? Sierra Circuits Inc, https://www.protoexpress.com/blog/analyze-pcb-transmission-line.
Qin F., Brosseau C. (2012). A review and analysis of microwave absorption in polymer composites filled with carbonaceous particles. Journal of Applied Physics, 111(6).
Qin F., Brosseau C., Peng H.X. (2011). In situ microwave characterization of microwire composites under mechanical stress. Applied Physics Letters, 99(25).
Qin F., Peng H.X., Prunier C., Brosseau C. (2010). Mechanical-electromagnetic coupling of microwire polymer composites at microwave frequencies. Applied Physics Letters, 97(15).
Rahimi A., Yoon Y.K. (2016). Study on Cu/Ni Nano Superlattice Conductors for Reduced RF Loss. IEEE Microwave and Wireless Components Letters, 26(4), 258-260.
Rautio J.C. (2007). EM-Component-Based Design of Planar Circuits. IEEE Microwave Magazine, 8(4), 79-90.
Rautio J.C. (2016). The IMaRC 2015 MTT-S SIGHT Special Event Amateur Radio Station. IEEE Microwave Magazine, 17(6).
Tsunooka T., Andou M., Higashida Y., Sugiura H., Ohsato H. (2003). Effects of TiO2 on sinterability and dielectric properties of high-Q forsterite ceramics. Journal of the European Ceramic Society, 23(14), 2573-2578.
Published
2019-09-26
How to Cite
Vantsov, S., Vasilyev, F., Medvedev, A., & Khomutskaya, O. (2019). Epoxy-glass composite materials for substrate printed circuit boards gigabit electronics. Amazonia Investiga, 8(22), 434-442. Retrieved from https://amazoniainvestiga.info/index.php/amazonia/article/view/767
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